为了保证航空电子设备制造商所使用的电子元器件与最终应用相符、Controllable，Ensure that the price is reduced while maintaining the quality of the product，In the 90s of the last century, Boeing first proposed the Electronic Component Management Plan (ECMP) based on the internal management document D6-55583，and unite with Honeywell、Airbus、Twenty-five major aircraft and aerospace products manufacturing companies, including British Airways, have established management systems，Use the program as a basis for avionics manufacturers。2001year，The International Electrotechnical Commission (IEC) has established a special technical committee on avionics process management (TC107)，In 2002, the company formulated and published IEC/PAS 62239 "Avionics Process Management - Development of Electronic Component Management Plan (ECMP)"，The management plan was adopted by the IEC in 2008 and published as a Technical Specification (TS).，In 2012、2015and 2017 have been supplemented and updated，of which the U.S. Department of Defense (DoD)、Federal Aviation Administration (FAA)、Organizations such as NASA were involved in the development of the standard throughout the process。
2.1适用范围
IEC/TS 62239《航空电子过程管理——电子元器件管理计划（ECMP）的制定》适用于航空电子元器件用户即航空设备制造商、Subcontractors、repair plants, etc，The basic requirements for the preparation of ECMP are specified：The developer of the management plan is required to provide assurances to the end user and the governing body，The selection and use of all electronic components used in the equipment is controllable，Match the end application，and meet the technical requirements specified in the technical specification。This technical specification states the objectives and technical points that need to be achieved，However, there is no specific work item、data and reports are constrained，Thus, the planner can take into account the objectives stated in the technical specifications，Document the most efficient of them。
2.2技术要求
IEC/TS 62239规定了ECMP需覆盖以下八个方面的内容：Component selection、Component use、Component quality assessment、quality assurance、Component trustworthiness、Conformity of components to the manufacturing process of the device、Component data information、Device status control。The ECMP also sets out detailed requirements for each technical element：
1）元器件选择
管理计划应满足以下技术：The implementer of the plan is required to formulate a plan that meets the technical requirements、Selection principles and preferred catalogs that meet specific conditions of use，At the same time, the use environment of the selected components should be clarified、Availability and risk of outages，and have additional requirements (e.g., escalation screening、Increases、additional parameter definitions, etc.).，Special quality assessments are carried out，In addition, the product manual of the selected component should be thoroughly checked during the selection process、Application note:、encapsulation、Reliability data、information such as production process data，So as to realize the control of the selection process of electronic components。
2）元器件use
针对设备的各种设计要素包括电磁兼容（EMC）、Derating and stress analysis、thermal analysis、Mechanical analysis、Testability、Maintainability、Aviation irradiation environment, etc，Documentation should be formed to prove that the components used are capable of being produced throughout the entire production、Storage and service life to meet the requirements of use。To determine that the design meets the requirements of the equipment，A formal design review should be conducted。At the time of the design review，For a wide range of components，All design aspects should be taken into account，and prepare reports。
3）元器件质量评定
元器件质量评定分为制造商的质量评定和产品的质量评定两个层级，The former requires verification of the component manufacturer's quality management system documentation、Manufacturing process management capabilities for repeatable manufacturing technologies，The latter requires the rationality of the selected components、Eligibility and suitability are verified，The product quality assessment plan should be specified in the document、The process of the test、sampling、You can receive information such as judgements。The form of component quality assessment includes data review and supplementary test verification，For new technologies or package types that have not been used before，Component quality assessment needs to be performed at both the component level and the device level，For new components that use existing technologies and package types，It is possible to pass only the equipment component quality assessment test，to test the conformity of the components。
4）元器件quality assurance
ECMP制定者应保证所有元器件在设备整个周期内质量和性能都是稳定的，Consistency of quality between batches of the same component，It is also necessary to ensure that the components delivered meet the requirements of the delivered equipment。
5）元器件可信性
在客户同意的设备质保期或维护期和/或同意的使用寿命内，As long as the customer uses these components within agreed environmental limits，The document should be formed to ensure the reliability of the components、Availability、Obsolescence management and maintainability。
6）元器件与设备制造过程的符合性
确认元器件与设备生产制造过程条件兼容，There will be no impact on quality and reliability，Documentation should be prepared to describe the critical manufacturing、assemble、Shipment、carry、stockpile、Test、Processes such as repairs and rework affect components and how to control them。
7）元器件数据信息
计划制定者应从元器件制造商、All relevant data is collected by the designer, manufacturer and user of the device，and save the data、Backup and restore、analyse、report。
8）状态控制
元器件在使用阶段，State control should be carried out。as a minimum，A list of controlled components and a list of original manufacturers of components should be included，If the component is not the original manufacturer，Components should be verified to meet the original manufacturer's data specifications and the level of quality and reliability。